TO-126

BD135 NPN transistor in a TO-126 package.

TO-126 is a type of semiconductor package for devices with three pins, such as transistors.^[1] The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink.

History and origin

The JEDEC TO-126 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 126. In the updated JEDEC outline system, the package is numbered as TO-225AA.^[2]

References

↑ BD135; BD137; BD139; NPN power transistors (PDF), Philips Semiconductors, 1999, retrieved 2013-12-09
↑ AN1040/D: Mounting Considerations For Power Semiconductors (PDF), On Semiconductor, 2001, retrieved 2014-01-25

Semiconductor packages

Diode	DO-204 (DO-35 / DO-41) DO-213 (MELF) DO-214 (SMA / SMB / SMC) SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)

Transistor	SOT / TSOT TO-3 TO-5 TO-18 TO-66 TO-92 TO-126 TO-220 TO-253 (DPAK) TO-263 (D2PAK)

Single row	SIP / SIL

Dual row	DFN DIP / DIL Flat Pack SO / SOIC SOP / SSOP TSOP / TSSOP ZIP

Quad row	LCC PLCC QFN QFP QUIP / QUIL

Grid array	BGA eWLB LGA PGA

Wafer	COB COF COG CSP Flip Chip PoP QP UICC WL-CSP / WLP

Related topics	Electronic packaging Integrated circuit packaging List of integrated circuit package dimensions List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology

Note: It's relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.

This article is issued from Wikipedia - version of the 11/7/2016. The text is available under the Creative Commons Attribution/Share Alike but additional terms may apply for the media files.

TO-126

History and origin

See also

References